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@digitooltv To remove the BGA chip, one must melt the solder to do so, and one must also melt the solder when the BGA chip is in place… It is in reference to this that I made my question.

@willy101010 You can write to the support department of dragon group china with the purchase number, they will direct you to videos of those machine working on with videos done in New York of the whole procedure.
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DGC Media

@MightyGimp Reballing is about fit balls into a chip to melt them later with the proper equipment, reballing is not about melting balls, if you do like that balls will connect between them and will be a bad repair, Reballing is about fit the balls in the chip with the flux help, not about melt them. That will be the last step when you put the chip back inot the board.

@submitter2islam That has no way to solve, you threw your money buying that machine.
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DGC Media

@submitter2islam , Well you bought a cheap imitation of a BIRD machine, that is what you get buying that piece of trash sir, they do not even speak English in that company, and all their brand development world wide was in charge of Dragon Group China, after they split ACHI is just trash with good will made by DGC , and they split exactly because ACHI wanted to replace all the internal parts with low quality parts made in China, instead of all the parts originally planned. Your problem is that.

Hi sir, I have bought ACHI IR6000 BGA work station. I have tried to remove the graphic chip of an Hp DV2000 laptop but no success after many trial on the same motherboard. I have set maximum temperature 220 degree celcius, but still no luck. What do you could be the problem? And, what do you think about IR6000 rework station? Thank inadvance.

Generally, if using a hot air station, when does one need to use low air setting, and when high setting? What temperature do you use for most BGAs? I’ve seen others using a hot air station and the heat set to 300 celsius, but mine won’t melt solder if not set to at least 420 and then it takes a while and can burn components. I suppose I need to invest in a preheater but I do this work rarely. In general, how long should it take from applying the hot air, to the solder melting?

my work area is indoors with a constant 70F air conditioned room in California. what number would you say airflow would be? like 1 or 2 on the knobs for air flow of the KADA 852D+. can u send me the link with u guys using the kada 852? i only see the manufacturing of one not putting it in use. thanks!

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@vette9998 , usually if a chip has losts pads is because many of chips cannot resist the use they get, and they just lost pads for over use, or bad assembly, many Xbox of first and second generations have had always this problem and reports indicate that the chips had not proper assembly in the first batches, the only way there is to replace full chip. Try to flux more and do more preheating than top heating, that will help you improve also your removing technique, preheating is the key and flux

@willy101010 , Willy, settings always depends on the weather where you are working, remember you are going to fit balls, not melt them completely, melting will be when you put the chip in the board again. You need to use very small flow of air so you dont send them away, and use the normal 180 to 200 air, about 2 to 3 cms, we have videos in break of the Kada working on that specifically. The flux is a extremely thin layer, if not the balls will skate on the chip. 559 ASM works

@jetsimo Sir, we do not have suggestions for that, only that check the chip exact reference, and order that exact stencil online, usually the stencils say which balls to use.

@davy06511 559 ASM is the type of flux, for both lift or reballing, just the consistency is different, if is lifting is flux gel, if is reballing cream is used, because in lifting you need heat dispersion and lubrication faster and direct, in reballing the cream is a so thin layer that just help the balls for a second while they fit in place. Also flux remember that is helping to avoid oxygen to get mixed into the procedures.

so i got the KADA 852D+ bga station from dragon empire. what is the best setting for air and temperature for reballing 0.45 and 0.6mm so that they melt properly and wont blow away? and how thin do you mean very for the flux? like paper thin or half paper thing? you said flux cream. i have amtech 559ASM will that work? thanks!

i bought the bird 4k which has been doing a good job removing the chips and also watching your videos for guidence. my question is everytime i pull the video chip off the boards the chips would be a very clean pull with all the solder still in place but on the motheroard there will be atleast 4-6 at a time black spots or what I think it is pulled solder pads.Today i put the chip back on the mboard with the missing pads i got 1 mboard with no video as usual and the other no power at all?

Hi. Im kind of lost here. Is the 559 ASM used for attaching balls onto the GPU? If yes, what is used for lifting of chip? Can I have full name? I know it’s gel but I can’t find “Flux Gel”, I need full name. Thanks!

@yvonnemyles06 I guess reballing balls. If is tape, would be insulation tape, also the tweezers are silver. Can you tell me the exact moment you want the answer for ?
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DGC Media

Question Sir, What is the small thing with silver color for reballing?

Very nice work. I am planing to reball my laptop’s video chip. The laptop is a lenovo ls510- 2847mu modele. Specs shows its a GMCH (Integrated video chip). The chip size is 33×33 mm but dont know ball size 0.45? 0.5? etc. I did not lift it yet, I am about to order the stencils, the flux (cream +gel), my only concern is the stencil size. Any suggestion would be well appreciated
Thanks

@ozzyme1220 Because takes practice to get to this level, keep practicing , you will for sure.

@CssniperAus 3M Silicone Remover, or Glue remover

I’m thinking of doing the same with my vga board however it seems to have some brown coloured glue, this would be my first attempt. Any tips :S

that sir was amazing…how come it doesnt work like that when i try it!? lol

do you ever have the solder balls flipping off the die when you are heating them on to it? I seem to get that all the time..

@digitooltv I haven’t sat down to do any circuit design/builds for 6 years. I mostly do software dev and ops now. Except for the occasional quick solder job I’m probably never going back to the part of my life.